Package Architect
Tsavorite Scalable Intelligence
Greater Bengaluru Area · Full Time
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- Experience
- 16+ yrs
- Salary
- —
- Openings
- 1
- Posted
- 7 hours ago
- Work mode
- In office
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Job description
About Tsavorite Scalable Intelligence
Established in 2023 by industry veterans with headquarters in California, USA, Tsavorite Scalable Intelligence is a product-oriented startup based in the Greater Bengaluru Area. The company develops innovative chipsets and intelligent machines that facilitate scalable enterprise AI, streaming video intelligence, training of trillion parameter models, and fine-tuning of large language models. Their mission is to empower enterprises with cutting-edge AI solutions that enhance productivity by offering advanced end-to-end AI systems from edge computing to Zettascale infrastructure. Tsavorite pioneers Agentic Silicon technology that revolutionizes AI model training, deployment, and scaling through state-of-the-art software and composable silicon chiplets.
Job Overview
We are seeking an experienced and highly skilled Package Architect to join our Bangalore team. This individual will play a crucial role in designing leading-edge AI product packages, overseeing feasibility studies for new IP and package concepts, and driving substrate layout design to successful tape-outs.
Primary Responsibilities
- Lead the package design efforts for Tsavorite's advanced AI product portfolio.
- Conduct feasibility assessments for innovative IP definitions and packaging design concepts.
- Manage the substrate layout design process from inception through tape-out of multiple products.
- Collaborate in co-design initiatives spanning silicon, packaging, and board levels.
- Work closely with signal integrity, power integrity, PCB design, mechanical, and thermal teams to optimize packaging designs that meet rigorous product requirements.
- Interface directly with OSAT and packaging suppliers to understand design constraints, validate package designs, ensure Design for Manufacturing (DFM) compliance, and document bills of materials.
Required Qualifications and Skills
- Over 16 years of professional experience specializing in flip chip Ball Grid Array (BGA) package design.
- Proficient with large form factor and high layer count designs, including stack-up definitions, bump and ball map development, and package outline drafting.
- Deep understanding of package design rules, design for manufacturing protocols, and proven record of multiple successful tape-outs.
- Knowledgeable about package-level signal integrity and power integrity considerations.
- Experience with high-speed SerDes technologies such as PCIe Gen6, 112-224 Gbps Ethernet, as well as memory interfaces including DDR5, LPDDR, and High Bandwidth Memory (HBM).
- Familiarity with Mentor Xpedition design tools is preferred.
Additional Information
The role requires strategic coordination with cross-functional teams and external suppliers to ensure design feasibility, manufacturability, and product excellence. Candidates who excel will be leaders in the AI silicon packaging space, driving innovations that support the next generation of AI technologies.