Staff / Senior Staff Engineer Package Technology Development

About the Role

Join our Research & Development team as a Staff or Senior Staff Engineer specializing in Package Technology Development. This role offers the chance to fuse your innovative ideas with technical skills to influence the future of technology, spearhead pioneering projects, and bring novel concepts to fruition.

Key Responsibilities

• Manage outsourced package platform qualification for lead and follower products, optimizing processes at subcontractors to achieve goals related to time-to-market, product quality, process capability, and assembly yield.
• Oversee package definition activities within the OSAT segment, including evaluating project complexity using Delta assessment lists, categorizing projects, assessing risks, and implementing mitigation strategies.
• Coordinate process integration up to process freeze for assembly and testing at subcontractors by developing assembly specifications, marking guidelines, and packaging standards for database entry.
• Apply and validate design rules based on baseline documentation and specific equipment capabilities at assembly locations, also supporting OSAT technical capability assessments.
• Select materials and define processes to satisfy moisture sensitivity level (MSL), reliability standards, and other packaging criteria for development phases.
• Lead or support enabling new package platforms and derivatives, assisting package and technology development efforts at OSAT including onboarding new subcontractors.
• Take charge or co-drive platform-related task force initiatives, demonstrating technical problem-solving leadership.

Professional Profile

• Possession of a Bachelor’s or Master’s degree in an engineering discipline.
• At least 10 years of experience in package development, especially new product introductions or processes related to pre-assembly, assembly, and testing; plus a minimum of 3 years supporting project management.
• Familiarity with module assembly, Wafer Level Packaging (WLP), bumping, eWLB, and System in Package (SiP) is highly advantageous.
• Solid understanding of laminate and leadframe package processes and materials, and their interaction with design functions and rules.
• Comprehensive knowledge of quality standards and release criteria such as JEDEC and AEC, aligned with product and package design as well as Bill of Materials selection.
• Strong analytical aptitude with ability to handle conflicts, uphold rigorous quality standards, and perform excellent problem solving.
• Proactive in sharing knowledge and best practices across departments, ambitious with capacity for timely decision-making.
• Highly driven with strong prioritization skills, able to work under pressure while motivating team members and engaging stakeholders.
• Team-oriented with experience collaborating across diverse, multicultural, and multi-site environments.
• Excellent communication and interpersonal skills at all organizational levels.
• Experience managing subcontractors.

Additional Information

Infineon Technologies is a global semiconductor leader focused on power systems and IoT solutions that support sustainability through green energy, clean mobility, and secure smart IoT applications. We foster diversity, inclusion, and equal opportunity, providing an open work culture grounded in trust and respect. Applicants are encouraged to inform recruiters if special arrangements are needed for the interview process.