R&D Process Engineer - Optocoupler Packaging

Job Overview

Join a leading semiconductor company as an R&D Process Engineer specializing in the development and implementation of packaging processes for innovative isolation devices.

Key Responsibilities

• Design and deploy advanced packaging processes tailored for novel isolation products.
• Assess material reliability and characteristics while researching advanced manufacturing methodologies.
• Plan and conduct Design of Experiments (DOE) to refine and enhance new process flows.
• Collaborate cross-functionally with IC designers, product engineers, manufacturing teams, support units, and contract manufacturers to develop and validate device processes through R&D initiatives.
• Analyze process yields and perform failure investigations to address device-specific challenges.
• Lead engineering initiatives aimed at cost reduction while significantly improving manufacturing yield, product quality, and reliability.

Requirements

• Proven expertise as an R&D Process Engineer with a focus on Optocoupler products.
• Strong foundation in Mechanical Engineering and semiconductor packaging development.
• Practical experience handling processes including Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, and operating Vision Inspection tools.
• Exceptional analytical and critical thinking abilities accompanied by a problem-solving and solution-driven approach.
• Knowledgeable in mechanical leadframe design principles and semiconductor physical failure analysis techniques.
• Understanding of IC packaging, high-voltage isolation demands, materials science, and process technologies.
• Experience managing New Product Introduction (NPI) projects, overseeing products from verification and qualification stages to large-scale soft launches, is advantageous.
• Proficient with CAD and simulation tools such as Solidworks and Ansys.